Wiring system for vehicle instrument panel wire encapsulated in

Details Wiring system for vehicle instrument panel wire encapsulated in Wiring system for vehicle instrument panel wire encapsulated in

1994-07-06

1995-08-15

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

138103, 174 47, 174 72A, 307 101, 361826, H05K 720

Patent

active

054425182

ABSTRACT:
A wiring system for a vehicle instrument panel, which includes a plurality of electronic subassembly components electrically connected to at least one wire, is encapsulated in a reconfigured ventilation duct structure located to the rear of the instrument panel. The ventilation duct structure, which extends between the subassembly components, is reconfigured to have at least one trough formed in it. The at least one trough has a finite length in at least one axial direction with an open side extending substantially along the length, so that the at least one wire may be received within the trough. The at least one wire is connected to at least one of the subassembly components. Wire restraints restrain the wire within the at least one trough.

REFERENCES:
patent: 2896213 (1959-07-01), Alderman et al.
patent: 3393350 (1968-07-01), Goudy
patent: 3710480 (1973-01-01), Royse et al.
patent: 3724357 (1973-04-01), Kavthekar
patent: 3956822 (1976-05-01), Folk
patent: 4189619 (1980-02-01), Pedlow
patent: 4210773 (1980-07-01), Haley et al.
patent: 4255610 (1981-03-01), Textoris
patent: 4271573 (1981-06-01), von Roesgen
patent: 4461061 (1984-07-01), Rock
patent: 4522114 (1985-06-01), Matsuno
patent: 4703543 (1987-11-01), Aceti et al.
patent: 4750265 (1988-06-01), Watanabe
patent: 4820189 (1989-04-01), Sergeant
patent: 4824164 (1989-04-01), Nakayama et al.
patent: 4942499 (1990-07-01), Shibata
patent: 4943241 (1990-07-01), Watanabe
patent: 5297334 (1994-03-01), Johnson

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