Wiring substrate with plurality of wiring and insulating...

Details Wiring substrate with plurality of wiring and insulating... Wiring substrate with plurality of wiring and insulating...

2009-02-17

2011-10-11

Prasad, Chandrika (Department: 2839)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

08035033

ABSTRACT:
In a wiring substrate in which plural wiring layers and insulating layers are alternately stacked and the adjacent wiring layers are electrically connected through a via hole formed in the insulating layer, plural holes constructing substrate management information recognizable as a character, a symbol, etc. are formed in the outside insulating layer of the insulating layers.

REFERENCES:
patent: 7365272 (2008-04-01), Hsu et al.
patent: 7838982 (2010-11-01), Nakamura
patent: 2002/0084314 (2002-07-01), Kim et al.
patent: 2005/0087364 (2005-04-01), Umemoto
patent: 2006/0131730 (2006-06-01), Nakamura
patent: 2009/0020323 (2009-01-01), Chen et al.
patent: 2011/0034022 (2011-02-01), Nakamura
patent: 2011/0042128 (2011-02-01), Hsu
patent: 2003-86735 (2003-03-01), None

Affiliated with

Also associated with

Rating

Wiring substrate with plurality of wiring and insulating... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring substrate with plurality of wiring and insulating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring substrate with plurality of wiring and insulating... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4293596