Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2011-06-28
2011-06-28
Patel, Ishwarbhai B (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S261000, C174S262000
Reexamination Certificate
active
07968803
ABSTRACT:
A wiring substrate of the invention comprises an electrical insulation substrate (1), a through-hole (3) formed in the electrical insulation substrate, electrically conductive paste (4) filled inside the through-hole, and wiring traces (11) formed on one or both surfaces of the electrical insulation substrate and electrically connected with the electrically conductive paste, wherein interfaces of the wiring traces in contact with the electrically conductive paste have at least one of an asperate surface and a smooth surface, and a plurality of granular bumps (14) formed further thereon.
REFERENCES:
patent: 5689879 (1997-11-01), Urasaki et al.
patent: 6827867 (2004-12-01), Yamamoto et al.
patent: 6889433 (2005-05-01), Enomoto et al.
patent: 6924043 (2005-08-01), Suzuki et al.
patent: 6-268345 (1994-09-01), None
patent: 2000-068620 (2000-03-01), None
patent: 2001-102754 (2001-04-01), None
patent: 2005-101398 (2005-04-01), None
Partial translation of JP 2005-101398, (Apr. 4, 2005).
Partial translation of JP 2001-102754, (Apr. 13, 2001).
Panasonic Corporation
Patel Ishwarbhai B
Wenderoth Lind & Ponack, LLP.
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