Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-03-08
2011-03-08
Nguyen, Khiem D (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S113000, C438S123000, C438S124000, C257SE21500, C257SE21499
Reexamination Certificate
active
07901986
ABSTRACT:
In a wiring substrate according to the present invention, a base wiring board is constructed by stacking a plurality of unit wiring boards each having wiring patterns which enable an electrical connection between upper and lower sides, in a state that the plurality of unit wiring boards are connected to each other via a connection terminal, and a silicon interposer is stacked on the base wiring board via a connection terminal, and a resin portion is filled in a gap between the plurality of unit wiring boards as well as a gap between the base wiring board and the silicon interposer, and a resin portion serves as a substrate which integrates the base wiring board and the silicon interposer.
REFERENCES:
patent: 6551858 (2003-04-01), Kawata et al.
patent: 6661088 (2003-12-01), Yoda et al.
patent: 7049692 (2006-05-01), Nishimura et al.
patent: 7119428 (2006-10-01), Tanie et al.
patent: 2004/0051168 (2004-03-01), Arai et al.
patent: 2004/0150118 (2004-08-01), Honda
patent: 2006/0022328 (2006-02-01), Lee
patent: 2006/0214153 (2006-09-01), Ikezawa et al.
patent: 2007/0023887 (2007-02-01), Matsui
patent: 2008/0136003 (2008-06-01), Pendse
patent: 2001-102479 (2001-04-01), None
patent: 2004-273938 (2004-09-01), None
Arai Tadashi
Kobayashi Toshio
Kim Su C
Kratz Quintos & Hanson, LLP
Nguyen Khiem D
Shinko Electric Industries Co. Ltd.
LandOfFree
Wiring substrate, manufacturing method thereof, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wiring substrate, manufacturing method thereof, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring substrate, manufacturing method thereof, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2776495