Wiring substrate for a matrix circuit

Details Wiring substrate for a matrix circuit Wiring substrate for a matrix circuit

1977-08-12

1979-01-23

Wojciechowicz, Edward J.

357 68, 357 69, 357 45, 357 71, H01L 2348

Patent

active

041363566

ABSTRACT:
A wiring substrate for a matrix circuit constituted by mounting a plurality of semiconductor chips in a multi-chip configuration, in which wiring conductors for interconnecting terminal electrodes of the individual chips and terminals of incoming and outgoing lines of the matrix circuit consist of first wiring conductors each for interconnecting the terminal electrodes of adjacent two chips and second wiring conductors for interconnecting the first wiring conductors at their middle portions, whereby the wiring lengths of the wiring conductors through any chips are made substantially equal to one another, thereby to establish uniform resistance among the wiring conductors for the chips with the width of the wiring conductors maintained constant.

REFERENCES:
patent: 3868724 (1975-02-01), Perrino
patent: 4021838 (1977-05-01), Warwick
patent: 4023197 (1977-05-01), Magdo et al.

Affiliated with

Also associated with

Rating

Wiring substrate for a matrix circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring substrate for a matrix circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring substrate for a matrix circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2275332