Wiring substrate, film carrier, semiconductor device made by usi

Details Wiring substrate, film carrier, semiconductor device made by usi Wiring substrate, film carrier, semiconductor device made by usi

1989-11-08

1991-12-10

Laroache, Eugene R.

357 80, 357 66, H01L 2348

Patent

active

050722891

ABSTRACT:
A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.

REFERENCES:
patent: 3868724 (1975-02-01), Perrino
patent: 4721995 (1988-01-01), Tanizawa
patent: 4774633 (1988-09-01), Dehaine
patent: 4926241 (1990-05-01), Carey
Patent Abstracts of Japan, vol. 10, No. 209 (E-421)(2265) 22 Jul. 1986, & JP-A-61 48952 (Toshiba) 10 Mar. 1986.
IBM Technical Disclosure Bulletin, vol. 30, No. 9, Feb. 1988, New York, U.S., pp. 353-354; "Process for Making a Self-Aligned Removable VLSI Connector", European Search Report.

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