Wiring substrate, display device, semiconductor chip, and...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S254000, C174S257000, C351S177000, C349S149000

Reexamination Certificate

active

07148427

ABSTRACT:
A wiring substrate is formed of a plurality of metal wirings14eformed on a substrate7c. A guard wiring29fabricated of an electrically conductive oxide such as ITO is interposed between at least a pair of adjacent ones of a plurality of metal wirings14e. When voltages V1,V2,V3,and V4applied to the metal wirings14eare related to be V1>V2>V3>V4,a guard wiring29is present between a metal wiring14efunctioning as an anode and a metal wiring14efunctioning as a cathode, and the anode metal wiring14eis prevented from being corroded.

REFERENCES:
patent: 5760855 (1998-06-01), Nakase et al.
patent: 6133581 (2000-10-01), Terao et al.
patent: 6300995 (2001-10-01), Wakagi et al.
patent: 6404026 (2002-06-01), Tsuyuki
patent: 6414888 (2002-07-01), Kitade et al.
patent: 6432738 (2002-08-01), Hatano et al.
patent: 10-215039 (1998-08-01), None
patent: 2000-221537 (2000-08-01), None
patent: 2000-252597 (2000-09-01), None
patent: 2000-294897 (2000-10-01), None
Communication from Japanese Patent Office re: counterpart application.

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