Wiring substrate and method of manufacturing the same

Details Wiring substrate and method of manufacturing the same Wiring substrate and method of manufacturing the same

2008-12-18

2011-11-15

Chervinsky, Boris (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S256000, C174S258000, C174S261000, C174S262000

Reexamination Certificate

active

08058562

ABSTRACT:
A wiring substrate is provided. The wiring substrate includes: a core layer in which a gap is formed; and a lamination layer which includes an insulating layer and a wiring layer and which is formed on at least one surface of the core layer. The lamination layer has a thermal expansion coefficient different from that of the core layer. A plurality of mounting regions on which an electronic component is to be mounted are provided on the lamination layer to be spaced from each other. The gap in the core layer is filled with an insulating member having the same material as the insulating layer and surrounds each of the plurality of mounting regions or each of mounting region groups including one or more of the mounting regions.

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