Wiring substrate and method of fabricating the same

Details Wiring substrate and method of fabricating the same Wiring substrate and method of fabricating the same

2005-05-26

2009-02-17

Lam, Cathy (Department: 1794)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S257000, C174S264000, C174S265000, C257S774000

Reexamination Certificate

active

07491895

ABSTRACT:
A wiring substrate is provided with an insulating resin film; and first and second conductive films provided on the back side and top side of the insulating resin film, respectively. The wiring substrate includes a via formed to fill a recess provided in the insulating resin film and electrically connecting the top side and back side of the insulating resin film. The via includes a first metal film formed to cover the side wall of the recess, an oxide film formed to cover the first meal film, and a second metal film formed on the metal oxide film.

REFERENCES:
patent: 3146125 (1964-08-01), Polichette et al.
patent: 3434939 (1969-03-01), Brown et al.
patent: 3560257 (1971-02-01), Schneble, Jr. et al.
patent: 4054479 (1977-10-01), Peiffer
patent: 4581301 (1986-04-01), Michaelson
patent: 4642161 (1987-02-01), Akahoshi et al.
patent: 4696861 (1987-09-01), Tatematsu et al.
patent: 5252195 (1993-10-01), Kobayashi et al.
patent: 5340947 (1994-08-01), Credle et al.
patent: 6188027 (2001-02-01), Miller et al.
patent: 2002/0185721 (2002-12-01), Hwang et al.
patent: 2002-110717 (2002-04-01), None
patent: 2003-249498 (2003-09-01), None

Affiliated with

Also associated with

Rating

Wiring substrate and method of fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring substrate and method of fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring substrate and method of fabricating the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4134984