Wiring substrate and bonding pad composition

Details Wiring substrate and bonding pad composition Wiring substrate and bonding pad composition

2008-06-17

2008-06-17

Lam, Cathy F. (Department: 1794)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S772000, C174S257000, C174S267000

Reexamination Certificate

active

07388296

ABSTRACT:
A wiring substrate comprised of a substrate main body made of glass-ceramic, a pad formed on a surface of the substrate main body and a conductor pin provided in an upright position on the pad. The pad is comprised of a ceramic that is the same as the ceramic constituting the glass-ceramic, Fe converted into Fe2O3and Cu. The Fe2O3comprises 1 to 28 parts by weight with respect to 100 parts by weight of the Cu.

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