Wiring substrate

Details Wiring substrate Wiring substrate

2006-04-26

2008-11-18

Lam, Cathy (Department: 1794)

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

C428S669000, C428S210000, C174S257000, C174S261000, C361S751000

Reexamination Certificate

active

07452612

ABSTRACT:
Provided is a wiring portion capable of suppressing diffusion from occurring in a wiring portion or between the wiring portion and a substrate.In the wiring substrate, a first high melting point metal portion18having a melting point higher than Au and Ag is provided between an Au wiring portion15and an Ag wiring portion17. The higher the melting point of the first high melting point metal portion18, the lower a coefficient thereof, that is, the harder diffusion occurs. In addition, the first high melting point metal portion19functions as a barrier material which adequately suppresses Ag from being diffused from the Ag wiring portion17. By providing the first high melting point metal portion18between the Au wiring portion15and the Ag wiring portion17, it is possible to more efficiently suppress Ag from diffusion, in comparison with a case where the Ag wiring portion and the Au wiring portion are in contact with each other.

REFERENCES:
patent: 5543208 (1996-08-01), Hasler
patent: 6742248 (2004-06-01), Wong et al.
patent: 2003-308791 (2003-10-01), None

Affiliated with

Also associated with

Rating

Wiring substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4044942