Wiring substrate

Details Wiring substrate Wiring substrate

2006-09-05

2006-09-05

Zarneke, David A. (Department: 2891)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

07102085

ABSTRACT:
A wiring substrate is configured such that a build-up layer is formed only on a front surface (a single side) of a core substrate and such that the distance between a semiconductor device mounted on the front surface thereof and an electronic component mounted on the back surface thereof or incorporated therein behind the back surface is reduced to thereby enhance electrical characteristics of an electrically continuous path therebetween, and whose overall strength is enhanced so as not to be prone to deflection or warpage. The wiring substrate includes a relatively thin first core substrate2having a front surface3and a back surface4;a relatively thick second core substrate6superposed on the back surface4of the first core substrate2and having a through opening9formed therein, the first substrate2and the through opening9defining a recess9;and a build-up layer BU formed on the front surface3of the first core substrate2and including wiring layers16and25and dielectric layers23and26.

REFERENCES:
patent: 6272020 (2001-08-01), Tosaki et al.
patent: 6326561 (2001-12-01), Watanabe et al.
patent: 6329610 (2001-12-01), Takubo et al.
patent: 6370013 (2002-04-01), Iino et al.
patent: 6373000 (2002-04-01), Nakamura et al.
patent: 6392301 (2002-05-01), Waizman et al.
patent: 6426470 (2002-07-01), Farquhar et al.
patent: 6480395 (2002-11-01), Kopf
patent: 6495770 (2002-12-01), Li et al.
patent: 6506982 (2003-01-01), Shigi et al.

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