Wiring substrate

Details Wiring substrate Wiring substrate

2011-08-23

2011-08-23

Talbot, Brian K (Department: 1715)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S098500, C427S098800, C427S099200, C427S123000, C427S307000

Reexamination Certificate

active

08003160

ABSTRACT:
A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises a substrate, an organic membrane formed on the substrate, and a metal wire formed on the organic membrane. An arithmetic mean deviation Ra of the profile of the surface of the organic membrane where the metal wire is formed is not less than 60 nm and not more than 5×10−2D, where D is the width of the metal wire. The contact angle with respect to water on the surface of the organic membrane where the metal wire is formed is not less than 110°.

REFERENCES:
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patent: 5157066 (1992-10-01), Shoji et al.
patent: 6027852 (2000-02-01), Sasaki et al.
patent: 2003/0139620 (2003-07-01), Yamaguchi
patent: 2004/0137159 (2004-07-01), Nakamura et al.
patent: 11-274371 (1999-10-01), None
patent: 2002-038094 (2002-02-01), None
patent: 2003-133692 (2003-05-01), None
patent: 2003-201571 (2003-07-01), None
patent: 2003-238577 (2003-08-01), None
Nikkei Electronics, Jun. 17, 2002, pp. 67-78 with English translation.
Japanese Office Action of Appln. No. 2003-431803 with partial translation dated May 12, 2009.

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