Wiring substrate

Details Wiring substrate Wiring substrate

1988-04-07

1989-05-02

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

252514, 361411, 361414, H05K 0109

Patent

active

048270830

ABSTRACT:
A wiring substrate which may be sintered with a minimum of cracking of the via-fills has a wiring substrate with wiring layers made of paste containing palladium powder and silver powder composed of spherical silver particles and flake-like silver particles, insulating layers made of a ceramic material and through-hole wirings formed by the paste within the insulating layers to provide electrical connection between the wiring layers.

REFERENCES:
patent: 3030237 (1962-04-01), Price
patent: 4001146 (1977-01-01), Horowitz
patent: 4098945 (1978-07-01), Oehmke
patent: 4419279 (1983-12-01), Abrams
patent: 4552691 (1985-11-01), Shoji et al.
patent: 4581158 (1986-04-01), Lin
patent: 4639830 (1987-01-01), Fukuoka
patent: 4663189 (1987-05-01), Borland
Y. Shimada et al., "Low Firing Temperature Multilayer Glass-Ceramic Substrate", Proceedings 1983, 33rd Electronic Components Conference, IEEE and the Electronic Assn., pp. 344-349.

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