Stock material or miscellaneous articles – Composite – Of polyimide
Patent
1994-03-15
1998-12-22
Lam, Cathy F.
Stock material or miscellaneous articles
Composite
Of polyimide
428209, 428458, 428694ML, 174258, 528353, G11B 540, C08G 6926
Patent
active
058516816
ABSTRACT:
This invention relates to a wiring structure having metal wiring layers and polyimide layers. An object of this invention is to overcome problems caused by oxidation of a metal surface, such as an increase in the resistance of wiring and a reduction in insulation, by preventing a reaction between a metal of the wiring layers, such as copper, and carboxyl groups of polyamic acid which make up the polyimide layers. In the wiring structure according to the present invention, the polyimide layers have been formed by heating and curing a resin composition which comprises a polyimide precursor, an amine compound and an organic solvent.
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Shih, et al., 42nd Electric Compounds and Technology Conference, pp. 1002-1014, 1992.
U.S. Ser. No. 7742044, filed Aug. 8, 1991.
Advanced Organic Chemistry, 3rd Edition; Francis A. Carey and Richard J. Sundberg.
Ikeda Shozi
Kataoka Fumio
Matsuyama Haruhiko
Matsuzaki Eiji
Shoji Fusaji
Hitachi , Ltd.
Lam Cathy F.
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