Wiring structure with metal wiring layers and polyimide layers,

Stock material or miscellaneous articles – Composite – Of polyimide

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428209, 428458, 428694ML, 174258, 528353, G11B 540, C08G 6926

Patent

active

058516816

ABSTRACT:
This invention relates to a wiring structure having metal wiring layers and polyimide layers. An object of this invention is to overcome problems caused by oxidation of a metal surface, such as an increase in the resistance of wiring and a reduction in insulation, by preventing a reaction between a metal of the wiring layers, such as copper, and carboxyl groups of polyamic acid which make up the polyimide layers. In the wiring structure according to the present invention, the polyimide layers have been formed by heating and curing a resin composition which comprises a polyimide precursor, an amine compound and an organic solvent.

REFERENCES:
patent: 4587197 (1986-05-01), Kojima et al.
patent: 4686147 (1987-08-01), Matsuyama et al.
patent: 4772505 (1988-09-01), Matsuyama et al.
patent: 4824731 (1989-04-01), Matsuyama et al.
patent: 5208656 (1993-05-01), Matsuyama et al.
patent: 5601905 (1997-02-01), Watanabe et al.
Shih, et al., 42nd Electric Compounds and Technology Conference, pp. 1002-1014, 1992.
U.S. Ser. No. 7742044, filed Aug. 8, 1991.
Advanced Organic Chemistry, 3rd Edition; Francis A. Carey and Richard J. Sundberg.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wiring structure with metal wiring layers and polyimide layers, does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring structure with metal wiring layers and polyimide layers, , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring structure with metal wiring layers and polyimide layers, will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2044712

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.