Wiring structure of termination circuit

Details Wiring structure of termination circuit Wiring structure of termination circuit

1987-11-18

1988-11-15

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361406, 361409, 361414, H05K 111

Patent

active

047851414

ABSTRACT:
A wiring structure for a termination circuit in which a termination circuit is connected to an integrated circuit through a fixed wiring pattern provided in a leadout layer closest to the mounting surface.

REFERENCES:
patent: 3898370 (1975-08-01), Davy et al.
patent: 4150421 (1979-04-01), Nishihara et al.
patent: 4371744 (1983-02-01), Badet et al.
patent: 4546413 (1985-10-01), Feinberg et al.
patent: 4562513 (1985-12-01), Arnold et al.
patent: 4613924 (1986-09-01), Brault
patent: 4620264 (1986-10-01), Ushifusa et al.
IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. CHMT-3, No. 4, Dec. 1980, "A Multilayer Ceramic Multichip Module", by A. J. Blodgett, Jr., pp. 634-637.
IBM Technical Disclosure Bulletin, vol. 22, No. 5, Oct. 1979, "Multilayer Ceramic Fixed Layer Substrate Design", Johnson et al., pp. 1841-1842.
Elektronik, vol. 29, No. 21, Oct. 1980, "Bessere Leiterplattenausnutzung mit neuem Mehrchip-IC-Gehause", H. Krumm, pp. 125-128.

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