Wiring structure of laminated capacitors

Details Wiring structure of laminated capacitors Wiring structure of laminated capacitors

2007-12-04

2010-06-22

Ha, Nguyen T (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S306100, C361S306300, C361S303000, C361S311000, C361S313000

Reexamination Certificate

active

07742276

ABSTRACT:
The present invention relates to a wiring structure for reducing the equivalent series inductance (ESL) of a laminated capacitor. The laminated capacitor comprises a number of conductive layers, a power via extending along a thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer, and a ground via extending along the thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer. The conductive layers include a set of first conductive layers and a set of second conductive layers. The power via is electrically coupled to the first conductive layers and the ground via is electrically coupled to the second conductive layers. The laminated capacitor further comprises a supplemental via between the power via and the ground via. The supplemental via is shorter in length than the power via and the ground via. The supplemental via is electrically coupled to one of the first conductive layers and the second conductive layer.

REFERENCES:
patent: 4570031 (1986-02-01), Inoue
patent: 4714952 (1987-12-01), Takekawa et al.
patent: 5161086 (1992-11-01), Howard et al.
patent: 5162977 (1992-11-01), Paurus et al.
patent: 5225969 (1993-07-01), Takaya et al.
patent: 5428885 (1995-07-01), Takaya et al.
patent: 5469324 (1995-11-01), Henderson et al.
patent: 5910755 (1999-06-01), Mishiro et al.
patent: 5912809 (1999-06-01), Steigerwald et al.
patent: 6021050 (2000-02-01), Ehman et al.
patent: 6043987 (2000-03-01), Goodwin et al.
patent: 6068782 (2000-05-01), Brandt et al.
patent: 6114015 (2000-09-01), Fillion et al.
patent: 6215649 (2001-04-01), Appelt et al.
patent: 6333857 (2001-12-01), Kanbe et al.
patent: 6343001 (2002-01-01), Japp et al.
patent: 6349456 (2002-02-01), Dunn et al.
patent: 6351369 (2002-02-01), Kuroda et al.
patent: 6370012 (2002-04-01), Adae-Amoakoh et al.
patent: 6370013 (2002-04-01), Iino et al.
patent: 6407929 (2002-06-01), Hale et al.
patent: 6446317 (2002-09-01), Figueroa et al.
patent: 6496356 (2002-12-01), Japp et al.
patent: 6524352 (2003-02-01), Adae-Amoakoh et al.
patent: 6556420 (2003-04-01), Naito et al.
patent: 6574090 (2003-06-01), Appelt et al.
patent: 6606237 (2003-08-01), Naito et al.
patent: 6610417 (2003-08-01), Andresakis et al.
patent: 6616794 (2003-09-01), Hartman et al.
patent: 6618238 (2003-09-01), Sanville, Jr. et al.
patent: 6621682 (2003-09-01), Takakuwa et al.
patent: 6625857 (2003-09-01), Appelt et al.
patent: 6678145 (2004-01-01), Naito et al.
patent: 6783620 (2004-08-01), Smith et al.
patent: 6789298 (2004-09-01), Fillion et al.
patent: 6795294 (2004-09-01), Kuroda et al.
patent: 6809268 (2004-10-01), Hayashi et al.
patent: 6813138 (2004-11-01), Jow et al.
patent: 6815085 (2004-11-01), Appelt et al.
patent: 6819543 (2004-11-01), Vieweg et al.
patent: 7050288 (2006-05-01), Ahiko et al.
patent: 7394643 (2008-07-01), Yamane et al.
patent: 7414857 (2008-08-01), Ritter et al.

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