Wiring structure, method of manufacturing the same,...

Details Wiring structure, method of manufacturing the same,... Wiring structure, method of manufacturing the same,...

2006-07-18

2006-07-18

Schechter, Andrew (Department: 2871)

Liquid crystal cells, elements and systems

Particular excitation of liquid crystal

Electrical excitation of liquid crystal

C349S039000

Reexamination Certificate

active

07079198

ABSTRACT:
The invention provides a wiring structure and a method for manufacturing the same for appropriately establishing an electrical connection between a first conductive layer constituting a part of a laminate and a conductive layer to be electrically connected thereto. The wiring structure can include, on a substrate, a capacitor provided with a first conductive layer, an insulating layer formed on the first conductive layer, and a second conductive layer formed on the insulating layer, a conductive layer electrically connected to the first conductive layer, and a relay layer located below the first conductive layer and the conductive layer, respectively to form a part of laminated structure. The first conductive layer and the conductive layer are electrically connected to each other through the relay layer.

REFERENCES:
patent: 6525788 (2003-02-01), Nakagawa et al.
patent: 6812975 (2004-11-01), Nagahiro
patent: 6894734 (2005-05-01), Ihara
patent: A-10-104660 (1998-04-01), None
patent: A 2001-305581 (2001-10-01), None
patent: A 2002-107745 (2002-04-01), None
patent: A 2002-122889 (2002-04-01), None
patent: A 2002-149089 (2002-05-01), None

Affiliated with

Also associated with

Rating

Wiring structure, method of manufacturing the same,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring structure, method of manufacturing the same,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring structure, method of manufacturing the same,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3558577