Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2005-09-13
2008-08-26
Norris, Jeremy C (Department: 2841)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C029S846000
Reexamination Certificate
active
07416759
ABSTRACT:
In a method of forming a wiring pattern, a plurality of electrical wirings deposited to be multilayered are conductively connected to one another through a conducting post. The method has forming the electrical wiring by discharging a first droplet including a material for forming the electrical wiring, and forming the conducting post by discharging a second droplet including a material for forming the conducting post, wherein a volume of the second droplet is greater than a volume of the first droplet.
REFERENCES:
patent: 5132248 (1992-07-01), Drummond et al.
patent: 5650199 (1997-07-01), Chang et al.
patent: 5954751 (1999-09-01), Chen et al.
patent: 6101363 (2000-08-01), Tomatsu
patent: 6309535 (2001-10-01), Williams et al.
patent: 6436256 (2002-08-01), Williams et al.
patent: 6493932 (2002-12-01), Haba
patent: 6790907 (2004-09-01), Takata et al.
patent: 6890063 (2005-05-01), Kim
patent: 2001/0018234 (2001-08-01), Jiang et al.
patent: 2001/0051392 (2001-12-01), Akram
patent: 2004/0000429 (2004-01-01), Furusawa et al.
patent: 2004/0060162 (2004-04-01), Moren
patent: 2004/0094842 (2004-05-01), Jimarez et al.
patent: 2004/0095441 (2004-05-01), Jeanmaire
patent: 2004/0129978 (2004-07-01), Hirai
patent: 2004/0145858 (2004-07-01), Sakurada
patent: A-2003-309369 (2003-10-01), None
patent: A-2004-186668 (2004-07-01), None
patent: A-2004-228375 (2004-08-01), None
Sakurada Kazuaki
Shintate Tsuyoshi
Uehara Noboru
Norris Jeremy C
Oliff & Berridg,e PLC
Seiko Epson Corporation
LandOfFree
Wiring pattern formation method, wiring pattern, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wiring pattern formation method, wiring pattern, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring pattern formation method, wiring pattern, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4002757