Wiring pattern formation method, wiring pattern, and...

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Reexamination Certificate

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C029S846000

Reexamination Certificate

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07416759

ABSTRACT:
In a method of forming a wiring pattern, a plurality of electrical wirings deposited to be multilayered are conductively connected to one another through a conducting post. The method has forming the electrical wiring by discharging a first droplet including a material for forming the electrical wiring, and forming the conducting post by discharging a second droplet including a material for forming the conducting post, wherein a volume of the second droplet is greater than a volume of the first droplet.

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