Wiring panel including wiring having a surface-reforming layer a

Details Wiring panel including wiring having a surface-reforming layer a Wiring panel including wiring having a surface-reforming layer a

1990-08-27

1992-12-29

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, 174258, 427400, H05K 100

Patent

active

051753995

ABSTRACT:
Disclosed herein is a wiring panel constructed with a substrate; an electrically conductive member laminated on the substrate and principally composed of copper; and an insulating member composed of an organic substance, wherein a very small amount of a non-metallic element is incorporated into the electrically conductive member, and a very small amount of a metal element is incorporated into the insulating member.
Also disclosed herein is a method for producing a wiring panel constructed with a substrate, an electrically conductive member provided on the substrate and composed of copper as the principal constituent, and an insulating layer of an organic substance covering the conductive member, which comprises steps of: applying onto the surface of the electrically conductive member a surface-reforming layer which functions to suppress electron transfer through the surface of the electrically conductive member, and thereafter forming the organic insulating layer on the electrically conductive member.

REFERENCES:
patent: 3960573 (1976-06-01), Zeblisky
patent: 4187198 (1980-02-01), Zeblisky
patent: 4350743 (1982-09-01), Lazzari
patent: 4668354 (1987-05-01), Levy
patent: 4668532 (1987-05-01), Moisan et al.
patent: 4751126 (1988-06-01), Oodaira et al.
patent: 4788104 (1988-11-01), Adriaensen et al.

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