Wiring method and apparatus for electronic circuit boards or the

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29853, 29854, 156196, 156199, 2281735, 269217, B21F 100, B25B 300, B25B 2700

Patent

active

049340441

ABSTRACT:
A method for wiring an electronic device including a plurality of electronic components and a plurality of connector elements for interconnecting the plurality of electronic components, the connector elements being arranged on the same plane in spaced relation to each other so as to define passages includes a number of steps. A first discrete line is connected to a surface of a first connector element such that the first discrete line extends on a first passage extending along the first connector element. Two pins are positioned along the first passage, substantially perpendicular thereto. The first discrete line is bent along the two pins, a distance between the at least two pins is then reduced, and the at least two pins are then moved away from the first passage. Similar, steps can be used to provide multiple discrete line between two connector elements or along the same passage between different connector elements.

REFERENCES:
patent: 2995357 (1961-08-01), Dennis et al.
patent: 3608190 (1971-09-01), Steranko et al.
patent: 4627162 (1986-09-01), Holt
patent: 4724612 (1988-02-01), Pearson

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wiring method and apparatus for electronic circuit boards or the does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring method and apparatus for electronic circuit boards or the, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring method and apparatus for electronic circuit boards or the will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2250646

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.