Wiring member and lead frame having the same

Details Wiring member and lead frame having the same Wiring member and lead frame having the same

1997-07-03

1998-07-28

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257773, 257666, H01L 2348, H01L 2352, H01L 2940

Patent

active

057866392

ABSTRACT:
A wiring member comprising a first electrode portion electrically connected with an electrode formed on a surface of a semiconductor element, a second electrode portion electrically connected with an electrode formed on an external circuit, and a wiring portion which connects the first electrode portion with the second electrode portion. The first electrode portion, the second electrode portion and the wiring portion are formed of a plate-shaped conductive body, and a thickness of the wiring portion is made not more than half as thick as the first electrode portion or the second electrode portion. Fine wiring can be achieved by making the lead as a wiring member for electrically connecting the semiconductor element electrodes with the external electrodes of the semiconductor device not more than half as thick as the lead frame material at need.

REFERENCES:
patent: 5202752 (1993-04-01), Honjo
patent: 5216278 (1993-06-01), Lin et al.
patent: 5306949 (1994-04-01), Yamada et al.
patent: 5444294 (1995-08-01), Suzuki
patent: 5508563 (1996-04-01), Tazawa et al.

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