Wiring line and manufacture process thereof, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

Reexamination Certificate

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Details

C257S059000, C257S072000, C257S758000, C257S775000, C257S750000, C438S022000, C438S128000

Reexamination Certificate

active

07420211

ABSTRACT:
To provide a technique for manufacturing a wiring line having a low resistance and a high heat resistance so as to make an active matrix type display device larger and finer. The wiring line is constructed of a laminated structure of a refractory metal, a low resistance metal and a refractory metal, and the wiring line is further protected with an anodized film. As a result, it is possible to form the wiring line having the low resistance and the high heat resistance and to form a contact with an upper line easily.

REFERENCES:
patent: 4433470 (1984-02-01), Kameyama et al.
patent: 5247190 (1993-09-01), Friend et al.
patent: 5305519 (1994-04-01), Yamamoto et al.
patent: 5323042 (1994-06-01), Matsumoto
patent: 5359219 (1994-10-01), Hwang
patent: 5399502 (1995-03-01), Friend et al.
patent: 5412240 (1995-05-01), Inoue et al.
patent: 5430320 (1995-07-01), Lee
patent: 5482871 (1996-01-01), Pollack
patent: 5567966 (1996-10-01), Hwang
patent: 5594569 (1997-01-01), Konuma et al.
patent: 5627345 (1997-05-01), Yamamoto et al.
patent: 5631478 (1997-05-01), Okumura
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5648277 (1997-07-01), Zhang et al.
patent: 5734187 (1998-03-01), Bohr et al.
patent: 5798559 (1998-08-01), Bothra et al.
patent: 5866484 (1999-02-01), Muto
patent: 5879982 (1999-03-01), Park et al.
patent: 5923962 (1999-07-01), Ohtani et al.
patent: 5937321 (1999-08-01), Beck et al.
patent: 5946799 (1999-09-01), Yamamoto et al.
patent: 6015997 (2000-01-01), Hu et al.
patent: 6016000 (2000-01-01), Moslehi
patent: 6030904 (2000-02-01), Grill et al.
patent: 6075292 (2000-06-01), Noguchi
patent: 6088596 (2000-07-01), Kawakami et al.
patent: 6096630 (2000-08-01), Byun et al.
patent: 6100573 (2000-08-01), Lu et al.
patent: 6118163 (2000-09-01), Gardner et al.
patent: 6133628 (2000-10-01), Dawson
patent: 6166396 (2000-12-01), Yamazaki
patent: 6175156 (2001-01-01), Mametani et al.
patent: 6198133 (2001-03-01), Yamazaki et al.
patent: 6246118 (2001-06-01), Buynoski
patent: 6281552 (2001-08-01), Kawasaki et al.
patent: 6495857 (2002-12-01), Yamazaki
patent: 6545359 (2003-04-01), Ohtani et al.
patent: 6787444 (2004-09-01), Gardner
patent: 2001/0001496 (2001-05-01), Yamazaki
patent: 2005/0007329 (2005-01-01), Hiroki et al.
patent: 02-012859 (1990-01-01), None
patent: 02-237039 (1990-09-01), None
patent: 03-194938 (1991-08-01), None
patent: 4-369271 (1992-12-01), None
patent: 5-102483 (1993-04-01), None
patent: 07-130652 (1995-05-01), None
patent: 7-130652 (1995-05-01), None
patent: 07-135318 (1995-05-01), None
patent: 07-226515 (1995-08-01), None
patent: 07-263589 (1995-10-01), None
patent: 07-335900 (1995-12-01), None
patent: 8-078329 (1996-03-01), None
patent: 08-078329 (1996-03-01), None
patent: 09-045927 (1997-02-01), None
patent: 09-172070 (1997-06-01), None
patent: 10-91640 (1998-04-01), None
patent: 10-092576 (1998-04-01), None
patent: 10-135468 (1998-05-01), None
patent: 10-135469 (1998-05-01), None
patent: 10-178095 (1998-06-01), None
patent: 10-247735 (1998-09-01), None
patent: WO 90/13148 (1990-11-01), None
Hatano, M. et al, “A Novel Self-Aligned Gate-Overlapped LDD Poly-Si TFT with High Reliability and Performance,” IEDM 97, pp. 523-526, (1997).
Schenk, H. et al, “Polymers for Light Emitting Diodes,” EURODISPLAY '99, Proceedings of the 19thInternational Display Research Conference, Berlin, Germany Sep. 6-9, pp. 33-37, (1999).
U.S. Appl. No. 09/464,189 (pending) to Ohtani et al filed Dec. 16, 1999, including specification, claims, abstract, drawings and PTO filing receipt.

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