Wiring forming method

Details Wiring forming method Wiring forming method

2009-06-16

2011-11-01

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Manufacture of electrical device controlled printhead

C438S006000, C347S054000, C347S055000, C347S064000, C427S100000, C427S123000

Reexamination Certificate

active

08048691

ABSTRACT:
Size reduction and high integration of each of the laminated substrates are achieved, while forming an excellent wiring which electrically connects the substrates to each other. A conductive ink, i.e., an ink, containing a conductive material is used, and in a state where a voltage is applied between a print head and a substrate unit, an ink droplet of the conductive ink is discharged from the print head, while relatively shifting the substrate unit and the print head substantially parallel to at least the upper surface of the substrate. Thus, a conductive layer which electrically connects electrodes to each other between the substrates is formed.

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International Search Report for International Application No. PCT/JP2009/060930 mailed Sep. 15, 2009 with English translation.

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