Wiring design tool improvement for avoiding electromigration by

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364490, H02B 120

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active

057375801

ABSTRACT:
A method for wiring IC chips such that electromigration criteria are met while minimizing the effect on overall chip wireability. A technique to optimize the width of automatically routed wire segments so that these widths are adequate to support the electromigration current on that net as a function of the capacitive loading of the net itself.

REFERENCES:
patent: H842 (1990-11-01), Ochs
patent: 3609480 (1971-09-01), Gerstner
patent: 4166279 (1979-08-01), Gangulee et al.
patent: 4713680 (1987-12-01), Davis et al.
patent: 4811237 (1989-03-01), Putatunda et al.
patent: 4827428 (1989-05-01), Dunlop et al.
patent: 5101261 (1992-03-01), Maeda
patent: 5171701 (1992-12-01), Nagamatsu
patent: 5243547 (1993-09-01), Tsai et al.
patent: 5280450 (1994-01-01), Nakagome et al.
patent: 5339253 (1994-08-01), Carrig et al.
patent: 5345394 (1994-09-01), Lin et al.
patent: 5349542 (1994-09-01), Brasen et al.
patent: 5404310 (1995-04-01), Mitsuhashi
patent: 5537328 (1996-07-01), Ito
IBM Technical Disclosure Bulletin, Y08-91-0160, P.S. Ho and C-K. Hu, vol. 35, No. 5, Oct. 1992, "Current Density-Line Length Design Criterion For Multi-Layered Interconnects.

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