Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
1996-02-23
2001-02-20
Gaffin, Jeffrey (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S262000, C174S251000, C174S261000
Reexamination Certificate
active
06191367
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a wiring construction body made from thick conductors to which a large current can be applied and which is used in electronic control devices such as an inverter or a servo, a method of manufacturing the same, and a circuit board using the wiring construction body.
BACKGROUND OF THE INVENTION
In electronic control devices such as an inverter or a servo, the electronic control function is realized by integrating various types of active components and passive components on a circuit board. Especially in such electronic control devices such as an inverter or a servo, power control is executed by using a large capacity diode, a transistor, or the like.
The conventionally, so-called DBC substrate or metal substrate, has been used as a substrate for a circuit using semiconductor elements emitting a large quantity of heat such as those for power. The DBC substrate comprises ceramics and a conductive material, with such materials as alumina ceramics and aluminum nitride ceramics used for the ceramic insulating material. Also copper is often used as a conductor in the DBC substrate, and the thickness is 0.3 mm in the typical specification.
On the other hand, as a metal base substrate, a circuit conductor is formed via an insulating layer made of an organic insulating material on a top surface of a base metal plate, and generally such metals as aluminum, copper, or iron are used as the material. In the conductor formed on a metal base substrate, generally a thickness of copper foil is around 0.1 mm, and a circuit on the substrate is generally formed by means of etching.
However, the etching system described above is suited to mass production because, for instance, a mask is manufactured, but it causes increase of cost when producing many types of product in a small lot respectively. In addition, when a conductor pattern is formed by etching, the thickness of the conductor becomes larger because of effects by side etching with the pattern precision lowered, and furthermore when mounting a bare chip on a substrate, a heat spreader is often used, which in turn results in increase of required parts.
Also when a thickness of a conductor becomes larger, it becomes difficult to form a fine pattern such as a control circuit due to side etching. Furthermore as a conductor's thickness is at most around 0.3 mm, there is a limit in amplitude of a current applied to the circuit, which makes it impossible to apply a large current, and even if a thickness of a conductor is made larger, sometimes such defects as warping occur in the substrate.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a wiring construction body which has an excellent pattern precision even though the thickness of conductor is large, which allows a control current and a large current to be applied. It is a further object to provide a wiring construction body which enables production of various types of product in a small lot, in which defects such as warping rarely occur, and which can be incorporated with a small number of parts, a method of manufacturing the same, and a circuit board using the wiring construction body.
In a wiring construction body according to an embodiment of the present invention, one or a plurality of circuit pattern conductors each formed into a prespecified form are mechanically jointed to each other with insulating resin and circuit patterns are formed on two surfaces thereof, so that precision of the circuit pattern is high and a control current and a large current can be applied thereto. Also, it is possible to form a desired circuit pattern, to insulate each individual circuit conductor and integrate them, as well as to electrically connect an upper surface of the wiring construction body to a bottom surface thereof easily.
In a wiring construction body according to another embodiment of the present invention, an insulating base is adhered to one of the two surfaces on which circuit patterns are formed, so that rigidity of the wiring construction body can be strengthened and also as an insulating base for fixing is used, one surface of the wiring construction body can be insulated.
In a wiring construction body according to another embodiment of the present invention, an insulating coating is adhered to one of the two surfaces or both surfaces on which circuit patterns are formed, so that rigidity of the wiring construction body can be strengthened, and an area of joint by soldering can be controlled, and furthermore, moisture resistance can be improved.
In a circuit board using the wiring construction body according to another embodiment of the present invention, one or a plurality of circuit pattern conductors each formed into a prespecified form mechanically connected to each other with insulating resin are provided and in which the circuit patterns are formed on two surfaces, the wiring construction body with the plurality of circuit pattern integrated to each other therein is electrically connected, or electrically connected and mechanically fixed to a printed circuit board, so that dimensional precision in forming patterns is improved, and also a large current section applies the wiring construction body formed by improving precision of the thick material with high electric conductivity and high-precision circuit board for a fine-pattern as well as a large current pattern can be formed by electrically connecting both of them to each other.
In a circuit board using the wiring construction body according to another embodiment of the present invention, a prespecified circuit pattern is formed by forming a groove section in a plurality of materials with high electric conductivity, the materials with high electric conductivity are provided in a plane form, the insulating resin is filled in the groove section formed with the materials with high electric conductivity, and the wiring construction body with the plurality of materials with high electric conductivity integrated to each other is electrically connected, or electrically connected and mechanically fixed to a printed circuit board so that a portion of the materials with high electric conductivity will protrude from an external periphery of the wiring construction body, so that a range where the wiring construction body and a circuit board can be applied is expanded, and also a number of required parts can be reduced.
In a circuit board using the wiring construction body according to another embodiment of the present invention, a bare chip is directly jointed to a conductor section of the wiring construction body, so that a heat spreader in a portion in which the bare chip is incorporated in the large current section is not required, and a number of parts can be reduced.
In a circuit board using the wiring construction body according to another embodiment of the present invention, a portion of or the entire section of the wiring construction body is a molded, so that warping in the board is reduced by adding thereto rigidity due to the molded material, which makes it possible to form high-reliability wiring construction body as well as circuit board.
Other objects and features of this invention will become understood from the following description with reference to the accompanying drawings.
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Patent Abstracts of Japan, No
Cuneo Kamand
Gaffin Jeffrey
Mitsubishi Denki & Kabushiki Kaisha
Sughrue Mion Zinn Macpeak & Seas, PLLC
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