Wiring circuit board having bumps and method of producing same

Details Wiring circuit board having bumps and method of producing same Wiring circuit board having bumps and method of producing same

2006-07-18

2006-07-18

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S843000, C216S018000

Reexamination Certificate

active

07076868

ABSTRACT:
A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 μm are formed by forming an etching mask for bump formation on bump formation surface of a metal foil which has a thickness (t1+t2) which is the sum of a thickness t1of a wiring circuit and a height t2of bumps to be formed on wiring circuit and which has a surface roughness of the bump formation surface thereof of 0.2 to 20 μm, and half etching the metal foil from the side of the etching mask for bump formation to a depth corresponding to the desired bump height t2.

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