Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2002-10-15
2004-03-30
Vigushin, John B. (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S261000, C029S830000, C029S831000
Reexamination Certificate
active
06713683
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a wiring board with terminals for use in connecting circuits in a variety of electronic devices and a method for such a wiring board.
BACKGROUND ART
In recent years, flexible wiring boards are in wide use in a variety of electronic devices for connection between a plurality of circuit boards on which electronic components have been mounted, or for connecting a circuit board with a motor or circuit components and the like.
Referring to
FIGS. 5 and 6
, a description will be given on such a conventional wiring board with terminals. For easy understanding of the structure, drawings are shown with the dimension in the direction of the thickness expanded.
FIG. 5
is a partially sectional view of a conventional wiring board with terminals, and
FIG. 6
is an exploded perspective view of a conventional wiring board with terminals. In the drawings, a plurality of wiring patterns
22
are formed by etching a thin film of a copper alloy and the like on the top surface of a film-like lower substrate
21
made of polyethylene terephthalate and the like having flexibility. Insulating layer
23
made of a polyester resin and the like covers the entire surface excluding connecting section
22
A on both ends of wiring pattern
22
. And, on the top surface of one end of connecting section
22
A of lower substrate
21
, terminal
25
is placed of which joining section
25
A on one end is roughly T-shaped and which is made of a thin metal plate. Also, anisotropically-conductive adhesive
27
is coated on the bottom surface of film-like upper substrate
26
made of polyethylene terephthalate and the like. Adhesive
27
is prepared by dispersing in a rubber-based adhesive such as chloroprene rubber electrically conductive powders made by plating nickel or resin with a precious metal. A wiring board having such structure has been formed in the following manner. (1) Joining section
25
A of terminal
25
made of a thin metal plate is placed on one end of connecting section
22
A of lower substrate
21
. (2) Upper substrate
26
is placed on connecting section
22
A. (3) By pressing from the top surface of upper substrate
26
with heat, anisotropically-conductive adhesive
27
softens and solidifies thereby cementing lower substrate
21
and upper substrate
26
while sandwiching terminal
25
.
A wiring board having above structure is installed in an electronic device. For example, lead wires of a motor and various elements are soldered to the end of terminal
25
, and circuit boards are connected to connecting section
22
A on the other end by means of a connector and the like. In this way, connection between a motor and the like and circuit boards are accomplished through terminal
25
, conductive powder in anisotropically-conductive adhesive
27
and wiring pattern
22
.
However, although such wiring board having terminals is superior in adhesion at room temperature, adhesive strength decreases when in use at elevated temperatures due to softening of anisotripically-conductive adhesive
27
thus lowering the holding power of terminal
25
. The reason for this is because anisotropically-conductive adhesive
27
that cements terminal
25
comprises relatively low softening-temperature rubber such as chloroprene rubber of which the adhesion decreases at elevated temperatures.
In order to solve this problem, while two or more adhesive materials may be blended, the selection of materials is difficult as blending is difficult depending on the material combination, or materials are limited.
DISCLOSURE OF THE INVENTION
A wiring board with terminals is provided which is constructed by forming between an upper and a lower substrates two layers of adhesives that have different softening temperatures. And a method for manufacturing such a wiring board is provided.
REFERENCES:
patent: 4588456 (1986-05-01), Dery et al.
patent: 5526563 (1996-06-01), Tamaki et al.
patent: 6034331 (2000-03-01), Tsukagoshi et al.
patent: 6333466 (2001-12-01), Miyaake et al.
patent: 6376050 (2002-04-01), Terasaki et al.
patent: 05-327209 (1993-12-01), None
Okuma Shinji
Takenaka Masatoshi
Parkhurst & Wendel L.L.P.
Vigushin John B.
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