Wiring board with lead pins, and lead pin

Details Wiring board with lead pins, and lead pin Wiring board with lead pins, and lead pin

2006-02-09

2008-09-09

Duverne, Jean F (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

Reexamination Certificate

active

07422449

ABSTRACT:
A wiring board with lead pins having high reliability is provided. When the lead pins are attached to electrode pads, the lead pins are attached to the electrode pads without leaving voids in a conductive agent, and bonding strength of the lead pins are improved. When the wiring board to which the lead pins are attached is reheated, the lead pins are prevented from being inclined or shifted from their normal positions. In the wiring board with lead pins formed by attaching head portions of the lead pins to the electrode pads formed on the wiring board through the conductive agent, the lead pin has notch portions are formed in cut-out shapes in peripheral edge portion of the disk shaped head portion.

REFERENCES:
patent: 5593322 (1997-01-01), Swamy et al.
patent: 6799976 (2004-10-01), Mok et al.
patent: 6976855 (2005-12-01), Kennedy et al.
patent: 54-122768 (1953-02-01), None
patent: 63-204752 (1988-08-01), None
patent: 2001-217342 (2001-08-01), None
patent: 2001-291815 (2001-10-01), None
patent: 2005-032905 (2005-02-01), None

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