Wiring board with core layer containing inorganic filler

Details Wiring board with core layer containing inorganic filler Wiring board with core layer containing inorganic filler

2005-03-22

2005-03-22

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S901000, C174S250000, C174S255000

Reexamination Certificate

active

06869665

ABSTRACT:
A wiring board includes a core layer and a pair of multilayer wiring portions. The core layer, having an upper surface and a lower surface, is formed from a resin composite which contains resin filler and encloses several pieces of carbon fiber cloth. One of the multilayer wiring portions is stacked on the upper surface of the core layer, while the other is stacked on the lower surface of the core layer. Each multilayer wiring portion is composed of a number of insulating layers and wiring patterns stacked alternately with the insulating layers. The wiring patterns of the upper and the lower wiring portions are connected to each other by conductors extending through the entire thickness of the core layer.

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