Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-01-07
2008-10-14
Dinh, Tuan T (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000, C361S765000, C361S782000, C174S259000, C174S262000
Reexamination Certificate
active
07436681
ABSTRACT:
The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structure and formed so that an overlapping area between a first lower electrode and a first upper electrode provided on respective surfaces of a first dielectric layer is a predetermined area; and a second capacitor that is built into the multilayer wiring structure along the same plane as the first dielectric layer and formed so that an overlapping area between a second lower electrode and a second upper electrode provided on respective surfaces of a second dielectric layer with the same thickness as the first dielectric layer is different from the predetermined area. The wiring board further includes: a line that electrically connects either one of a power pad for supplying power to the IC chip and a ground pad for grounding the IC chip to either one of the first lower electrode and the second lower electrode; and a line that electrically connects the other of the power pad and the ground pad to the other of the first upper electrode and the second upper electrode.
REFERENCES:
patent: 5027253 (1991-06-01), Lauffer et al.
patent: 6446317 (2002-09-01), Figueroa et al.
patent: 6775150 (2004-08-01), Chakravorty et al.
patent: 6876554 (2005-04-01), Inagaki et al.
patent: 2005/0141169 (2005-06-01), Yamasaki
patent: 2006/0113631 (2006-06-01), Yang et al.
patent: 03-132086 (1991-06-01), None
patent: 05-036857 (1993-02-01), None
patent: 2005-191266 (2005-07-01), None
Dinh Tuan T
Ibiden Co. Ltd.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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