Wiring board with bending section

Details Wiring board with bending section Wiring board with bending section

2006-09-19

2006-09-19

Abrams, Neil (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C349S150000

Reexamination Certificate

active

07108515

ABSTRACT:
A wiring substrate to be used in a variety of electronic apparatuses, and an input device, such as an optically transparent touch panel, using the same wiring substrate, and a method of manufacturing the same input device are disclosed. The invention simplifies a construction of the wiring substrate, reduces the number of manufacturing steps of the substrate, and makes all the connectors of the substrate in a single-sheet structure. The electrical and mechanical connections of those connectors to other connecting means can be thus highly reliable. Plural wiring patterns22, 23, 24and25, and connectors22A,23A,24A and25A are formed on a first principal surface of wiring substrate20. Substrate20includes flexible bending section P—P, and when substrate20is bend along bending section P—P, some connectors such as24A,25A are placed on a second principal surface opposite to the first one, so that wiring substrate20is formed.

REFERENCES:
patent: 3805213 (1974-04-01), Austin
patent: 4561709 (1985-12-01), Fukukura
patent: 5134252 (1992-07-01), Himeno et al.
patent: 6304251 (2001-10-01), Ito et al.
patent: 2003-108302 (2003-04-01), None

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