Wiring board, semiconductor device, and method for...

Details Wiring board, semiconductor device, and method for... Wiring board, semiconductor device, and method for...

2005-04-15

2011-11-15

Norris, Jeremy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C361S783000

Reexamination Certificate

active

08058565

ABSTRACT:
In a semiconductor device (1), a package board (2) is provided in which a plurality of wiring layers are layered, a plurality of mounting pads (5) arranged in a matrix are provided to the uppermost wiring layer of the package board (2), and solder bumps (7) are connected to the mounting pads (5). A semiconductor chip (9) is mounted on the package board (2) via the solder bumps (7). The uppermost wiring layer of the package board (2) is formed from a resin material in which the Young's modulus is 1 GPa or lower when the temperature is 10 to 30° C., and the elongation at break is 50% or higher.

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Japanese Official Action dated Mar. 15, 2011.
Japanese Official Action dated Sep. 13, 2011, with translation.

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