Wiring board provided with a heat bypass layer

Details Wiring board provided with a heat bypass layer Wiring board provided with a heat bypass layer

1990-11-27

1994-02-08

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361688, H05K 100

Patent

active

052850161

ABSTRACT:
Disclosed herein are high density wiring boards useful in computers, communication equipment and the like. They include a layer for bypassing heat to be generated. Heat generated at a conductor and/or a resistor in each wiring board is allowed to spread out evenly via the heat bypass layer.

REFERENCES:
patent: 3617816 (1971-11-01), Riseman
patent: 4782381 (1988-11-01), Ruby et al.
patent: 4993148 (1991-02-01), Adachi et al.

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