Wiring board, method for manufacturing same and...

Details Wiring board, method for manufacturing same and... Wiring board, method for manufacturing same and...

2005-11-17

2011-12-06

Norris, Jeremy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C361S792000

Reexamination Certificate

active

08071881

ABSTRACT:
A wiring board which includes a product portion configured with at least one layer of electrically insulating base, a wiring pattern formed on the surface or inner portion of the electrically insulating base, and a wiring protection layer which is formed on the surface of the board and has an opening. Warping over the entire wiring board can be reduced since this wiring board has a warp-correcting portion warped in a direction different from that of the product portion.

REFERENCES:
patent: 3-239528 (1991-10-01), None
patent: 9-172104 (1997-06-01), None
patent: 11-176886 (1999-07-01), None
patent: 2002-076530 (2002-03-01), None
patent: 2002-100696 (2002-04-01), None
patent: 2003-031926 (2003-01-01), None
patent: 2003-236982 (2003-08-01), None
Machine Translation of JP 2002-076530 (Mar. 15, 2002).
Machine translation of JP 09-172104 (Jun. 30, 1997).
International Search Report (PCT/JP2005/021115) dated Feb. 28, 2006.

Affiliated with

Also associated with

Rating

Wiring board, method for manufacturing same and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring board, method for manufacturing same and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring board, method for manufacturing same and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4302786