Wiring board, method for manufacturing same, and...

Details Wiring board, method for manufacturing same, and... Wiring board, method for manufacturing same, and...

2006-06-15

2010-11-23

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S262000

Reexamination Certificate

active

07838779

ABSTRACT:
A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.

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Toshinori Koyama et al. “Package Having All-Layer Fine-Pitch IVH,” Oct. 2001, Proceeding of the 11thMicroelectronics Symposium, pp. 131-134.

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