Wiring board manufacturing method

Details Wiring board manufacturing method Wiring board manufacturing method

2011-05-03

2011-05-03

Levi, Dameon E (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S256000, C361S751000

Reexamination Certificate

active

07935891

ABSTRACT:
The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

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Notice of Rejection date Jul. 13, 2010, issued in corresponding Japanese Patent Application No. 2008-127142.

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