Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-07-10
2007-07-10
Nasri, Javaid H. (Department: 2839)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Reexamination Certificate
active
10530518
ABSTRACT:
To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.
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Imamura, et al., “Judo Buhin Naizo B2it™ Haisenban”, Micro Electronics Symposium Ronbunshu, Dai 12 Kai, pp. 311-314, (Oct. 8, 2002).
Microfilm of the specification and drawings annexed to the request of Japanese Utility Model Application No. 164627/1978 (Laid-open No. 81966/1980) Hitachi Denshi, Ltd., pp. 1-7, (Jun. 5, 1980).
Notification of Transmittal of Copies of Translation of the International Preliminary Examination Report and International Preliminary Report on Patentability issued by the International Bureau of WIPO.
Fukuoka Yoshitaka
Hirai Hiroyuki
Imamura Tatsuro
Matsumura Ken-ichi
Sasaoka Kenji
Dai Nippon Printing Co. Ltd.
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Nasri Javaid H.
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