Wiring board having efficiently arranged pads

Details Wiring board having efficiently arranged pads Wiring board having efficiently arranged pads

2009-02-27

2011-11-08

Hyeon, Hae Moon (Department: 2839)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

08053680

ABSTRACT:
A wiring board includes a plate-shaped resin member; chip connection pads provided in the resin member, the chip connection pads having connection surfaces electrically connected to electrode pads provided on a semiconductor chip, the connection surfaces being situated in substantially the same plane as a first surface of the resin member, the first surface being a side where the semiconductor chip is mounted; pads provided in a portion of the resin member, the portion being situated outside an area where the chip connection pads are formed; lead wirings connected to the pads; and conductive wires sealed by the resin member, the conductive wires electrically connecting the chip connection pads and the pads to each other.

REFERENCES:
patent: 6469260 (2002-10-01), Horiuchi et al.
patent: 7164085 (2007-01-01), Saiki
patent: 7656013 (2010-02-01), Horiuchi et al.
patent: 2004/0194999 (2004-10-01), Tomita et al.
patent: 2001-319992 (2001-11-01), None

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