Wiring board for mounting electronic devices with high-density t

Details Wiring board for mounting electronic devices with high-density t Wiring board for mounting electronic devices with high-density t

1996-05-16

1999-11-30

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

174261, 174262, 361737, 361741, 361746, 361767, 361808, 361810, 428901, B32B 300

Patent

active

059939460

ABSTRACT:
A lattice of a wiring or terminal pattern is varied at areas on a wiring board. The spacing of the wiring lattice is reduced only in a predetermined area for a device having many terminals. An alignment pattern is provided in the predetermined area. The spacing of the wiring lattice in the central portion of the wiring board may be the finest and may get gradually coarser toward the peripheral portion of the wiring lattice.

REFERENCES:
patent: 3447038 (1969-05-01), Liben
patent: 4641425 (1987-02-01), Dubuisson et al.
patent: 4685033 (1987-08-01), Inoue
patent: 4731699 (1988-03-01), Nitta et al.
patent: 4816323 (1989-03-01), Inoue
patent: 5034802 (1991-07-01), Liebes, Jr. et al.
patent: 5241134 (1993-08-01), Yoo
patent: 5406459 (1995-04-01), Tsukamoto et al.
patent: 5484963 (1996-01-01), Washino
patent: 5488542 (1996-01-01), Ito
patent: 5861664 (1999-01-01), Inoue

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