Wiring board for high-frequency signals and semiconductor module

Details Wiring board for high-frequency signals and semiconductor module Wiring board for high-frequency signals and semiconductor module

1996-10-03

1998-06-09

Gensler, Paul

Wave transmission lines and networks

Long lines

Strip type

174250, 333247, 361767, H01P 308

Patent

active

057641196

ABSTRACT:
A wiring board for high-frequency signals, which comprises, a substrate, a dielectric layer formed on the substrate and provided on its surface with a U-shaped groove having an arcuate bottom for forming a wiring therein, and a signal wiring formed in the U-shaped groove, which is featured in that an upper end portion of the signal wiring is protruded out of the surface of the dielectric layer. A distance (H) from a protruded top surface of the signal wiring to a bottom of the U-shaped groove and a width (W) of the U-shaped groove preferably meet a relationship of 2<(W/H)<50, and the height of the portion of signal wiring which is protruded out of the surface of the dielectric layer is preferably in the range of 10 nm to 10 .mu.m.

REFERENCES:
patent: 3702427 (1972-11-01), Learn et al.
patent: 5046238 (1991-09-01), Daigle et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5426399 (1995-06-01), Matsubayashi et al.
patent: 5451722 (1995-09-01), Gregoire
Dinella, Method Of Grounding A Printed Circuit Board Western Electric Technical Digest No. 16, p. 1, Oct. 1969.
Takeshi Toda, et al. "Characteristics of U-Grooved Microstrip Lines", Proceeding of the 1994 Electronics Society Conference of IEICE, C-144, (p. 2-649), 1994.

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