Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-11-16
2008-10-14
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S767000, C174S260000
Reexamination Certificate
active
07436682
ABSTRACT:
A flip chip mounting method for improving the accuracy of positioning of a semiconductor chip and avoiding a short circuit between protruding electrodes even when the protruding electrodes are formed at smaller spacings. The method comprises: placing a semiconductor chip on a wiring board, the semiconductor chip having protruding electrodes formed at a relatively small spacing and at a relatively large spacing, the wiring board having electrode pads corresponding to the respective protruding electrodes and solder pieces formed on the respective pads; heating the semiconductor chip and the wiring board to a temperature at which only the solder pieces on the electrode pads of greater spacing melt; performing self alignment of the semiconductor chip by the melted solder pieces; and heating the semiconductor chip and the wiring board further to a temperature at which the protruding electrodes and the solder pieces on the electrode pads of smaller spacing melt.
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Nishitani Yuji
Ohde Tomoshi
Aychillhum Andargie M
Katten Muchin & Rosenman LLP
Reichard Dean A.
Sony Computer Entertainment Inc.
Sony Corporation
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