Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2006-04-20
2010-06-08
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257SE23019, C257SE23025, C257SE23060, C257SE23077, C257SE21503, C257S786000, C257S668000, C257S752000
Reexamination Certificate
active
07732935
ABSTRACT:
A wiring board includes a substrate made of an insulation material and wired by a conductive material. A plurality of electrodes is formed on a surface of the substrate. A non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer are formed as the electrodes.
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Jun. 18, 2009 European search report in connection with a counterpart European patent application No. 05 77 0814.
Cooper & Dunham LLP
Ricoh & Company, Ltd.
Ricoh Microelectronics Co. Ltd.
Williams Alexander O
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