Wiring board constructions and methods of making same

Details Wiring board constructions and methods of making same Wiring board constructions and methods of making same

1997-10-07

1999-12-21

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174266, 361767, 439 82, 29853, 427 97, H01R 909

Patent

active

060051981

ABSTRACT:
A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped recess in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.

REFERENCES:
patent: 5487218 (1996-01-01), Bhatt et al.
patent: 5662987 (1997-09-01), Mizumoto et al.
patent: 5699613 (1997-12-01), Chong et al.
patent: 5715595 (1998-02-01), Kman et al.
patent: 5744758 (1998-04-01), Takenouchi et al.
patent: 5840402 (1998-11-01), Roberts et al.
Clyde F. Coombs, Jr., "Printed Circuits Handbook", published by McGraw-Hill Copyright 1996.

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