Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2000-11-24
2003-01-14
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S668000, C257S701000, C257S690000, C257S693000
Reexamination Certificate
active
06507095
ABSTRACT:
TECHNICAL FILED
The present invention relates to a wiring board, a connected board and a semiconductor device, method of manufacture thereof, a circuit board, and an electronic instrument.
BACKGROUND OF ART
Among compact semiconductor devices are such as CSP (Chip Size/Scale Package) or BGA (Ball Grid Array) type packages, in which solder balls are used as external terminals.
The solder balls are positioned and mounted on a wiring board, are fused in a reflow process and bonded to a wiring pattern, and are then washed. For this reason, expensive ball mounter equipment, reflow equipment and washing equipment are required. Moreover, in the reflow process thermal stress is applied, and in the washing process solvent stress is applied, and as a result the package is damaged.
DISCLOSURE OF THE INVENTION
The present invention was devised in the light of the above described problems, with the objective of providing a wiring board, a connected board and a semiconductor device, method of manufacture thereof, a circuit board, and an electronic instrument which make it possible to carry out processing without expensive equipment, and to avoid damage to the package.
(1) A wiring board of the present invention comprises:
a substrate in which an opening is formed; and
a wiring pattern having a bent portion,
wherein the wiring pattern is formed on one surface of the substrate so that the opening and the bent portion overlap each other, and
wherein an inside of the bent portion is filled with a stress-absorbing material.
According to the present invention, a part of the wiring pattern intrudes into the opening. This bent portion can be used as the external terminals of the semiconductor device or the like. Therefore, processing can be carried out without expensive equipment, and damage to the package can be avoided. In the present invention, by means of the stress-absorbing material, stress applied to the bent portion is absorbed.
(2) In this wiring board,
the bent portion may be formed having a height such as not to protrude from another surface of the substrate.
(3) In this wiring board,
the bent portion may constitute a protrusion protruding from the other surface of the substrate.
According to the present invention, a part of the wiring pattern intrudes into the opening, and the bent portion protrudes from the opposite surface of the substrate. This bent portion can be used as the external terminals of the semiconductor device or the like, and therefore solder balls can be omitted. Therefore, processing can be carried out without expensive equipment, and damage to the package can be avoided.
(4) In this wiring board,
a protective member thicker than a protruding height of the protrusion may be provided on the other surface of the substrate.
By means of this, the bent portion is protected by the protective member, and deformation is prevented. A semiconductor device or the like using such a wiring board can be mounted on a circuit board after releasing the protective member.
(5) In this wiring board,
an adhesive may be interposed between the substrate and the wiring pattern.
By means of this, stress applied to the bent portion can be absorbed by the adhesive.
(6) In this wiring board,
the bent portion of the wiring pattern may be narrower than a diameter of the opening, and forms a bent interconnect.
(7) In this wiring board,
the bent portion of the wiring pattern may be formed by ending a portion of a land larger than the opening.
(8) In this wiring board,
an end of the bent portion of the wiring pattern may be fractured.
In this way, since the bent portion is electrically connected to the wiring pattern even though its end is fractured, it can be used as the external terminals.
(9) In this wiring board,
an end of the bent portion of the wiring pattern may be terminated to avoid the surface of the substrate.
In this way, the end of the bent portion, even if not supported by the substrate, is electrically connected to the wiring pattern, and can therefore be used as the external terminals.
(10) In this wiring board,
the opening may be a slit, and a plurality of the bent portions may be formed within each the opening.
(11) A wiring board of the present invention comprises:
a substrate in which an opening is formed; and
a wiring pattern formed on one surface of the substrate, and having a bent portion protruding from the one surface in the direction opposite to the opening.
According to the present invention, the bent portion formed by part of the wiring pattern protruding can be used as the external terminals of the semiconductor device or the like. Therefore, processing can be carried out without expensive equipment, and damage to the package can be avoided.
(12) In this wiring board,
an adhesive may be interposed between the substrate and the wiring pattern.
By means of this, stress applied to the bent portion can be absorbed by the adhesive.
(13) In this wiring board,
a concavity formed on the concave surface of the bent portion of the wiring pattern may be filled with resin.
By means of this, not only is the form of the bent portion maintained by the resin with which the concavity is filled, but also stress applied to the bent portion can be absorbed by the resin.
(14) In this wiring board,
the bent portion of the wiring pattern may be narrower than a diameter of the opening, and forms a bent interconnect.
(15) In this wiring board,
the bent portion of the wiring pattern may be formed by bending a portion of a land larger than the opening.
(16) In this wiring board,
an end of the bent portion of the wiring pattern may be fractured.
In this way, since the bent portion is electrically connected to the wiring pattern even though its end is fractured, it can be used as the external terminals.
(17) In this wiring board,
an end of the bent portion of the wiring pattern may be terminated to avoid the surface of the substrate.
In this way, the end of the bent portion, even if not supported by the substrate, is electrically connected to the wiring pattern, and can therefore be used as the external terminals.
(18) In this wiring board,
the opening may be a slit, and a plurality of the bent portions may be formed within each the opening.
(19) A wiring board of the present invention comprises:
a substrate in which an opening is formed; and
a wiring pattern having a bent portion,
wherein the wiring pattern is formed on one surface of the substrate so that the opening and the bent portion overlap each other, and
wherein a sealing material sealing the opening is provided on a concave side of the bent portion.
According to the present invention, the concave side of the bent portion can also be used as an electrical connection region, with the sealing material interposed.
(20) In this wiring board,
an inside of the bent portion may be filled with the sealing material formed of a conductive substance.
By means of this, electrical connection with the inner surface of the bent portion can be achieved, with the conductive substance interposed.
(21) In this wiring board,
an inside of the bent portion may be filled with an insulating resin, and
the sealing material may be a conductive substance, formed on the insulating resin.
By means of this, on the insulating resin, electrical connection with the wiring pattern can be achieved with the conductive substance interposed.
(22) In this wiring board,
the sealing material may be provided over the concavity to reach as far as the wiring pattern, and leaving an inside of the bent portion hollow.
By means of this, since the bent portion is easily deformable, stress can be absorbed by the bent portion.
(23) A wiring board of the present invention comprises:
a substrate in which an opening is formed; and
a wiring pattern formed on one surface of the substrate, and having a bent portion protruding from the one surface in the direction opposite to the opening,
wherein the opening of the substrate and an inside of the bent portion are filled with a sealing material sealing the opening.
According to the present invention, the concave side of the bent portion can also be
Huynh Andy
Seiko Epson Corporation
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