Wiring board and soldering method therefor

Details Wiring board and soldering method therefor Wiring board and soldering method therefor

2006-02-14

2006-02-14

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB, C361S761000

Reexamination Certificate

active

06998861

ABSTRACT:
A circuit board for surface mounting by solder flow an electronic component having narrow lead pitches, the board having a first solder leading land having a first side and located on the circuit board adjacent to a land for mounting an electronic component, and a second solder leading land located next to the first solder leading land and opposite the first side of the first solder leading land. A method for flow soldering a surface mounted electronic component on such a circuit board, wherein the second solder leading land is positioned at a rear end of the circuit board against a direction of a movement of the circuit board when the circuit board moves toward a solder flow.

REFERENCES:
patent: 5010448 (1991-04-01), Kobari
patent: 5679929 (1997-10-01), Greenfield et al.
patent: 5877033 (1999-03-01), Matern
patent: 2-54598 (1990-02-01), None
patent: 05315733 (1993-11-01), None
patent: 6-164120 (1994-06-01), None
patent: 8-323495 (1996-12-01), None
patent: 11-251725 (1999-09-01), None
patent: 2000-40869 (2000-02-01), None

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