Wiring board and semiconductor package using the same

Details Wiring board and semiconductor package using the same Wiring board and semiconductor package using the same

2008-07-08

2008-07-08

Dinh, Tuan (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S262000

Reexamination Certificate

active

07397000

ABSTRACT:
A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT(GPa) and a breaking strength at a temperature of T° C. is given as HT(MPa).(1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less(2) D23≧5(3) D150≧2.5(4) (D−65/D150)≦3.0(5) H23≧140(6) (H−65/H150)≦2.3.

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T. Koyama et al. “Package fabricated with all layers incorporating fine pitch IVH”, Proceedings for the Eleventh Microelectronics Symposium, Oct. 2001, pp. 131-134.

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