Wiring board and process for producing the same

Details Wiring board and process for producing the same Wiring board and process for producing the same

2005-08-02

2005-08-02

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S795000

Reexamination Certificate

active

06924987

ABSTRACT:
A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a second conductor layer that is provided with a conductor pattern connected through a via to a ground wiring, for supplying a power supply of ground potential to the semiconductor chip; and a third conductor layer that is provided with a power supply terminal connected through a via to a power supply wiring for supplying an operation power supply of a potential other than the ground potential to the semiconductor chip, a signal terminal connected through a via to a signal wiring for transmitting an electric signal, and a ground terminal connected through a via to the conductor pattern in the second conductor layer.

REFERENCES:
patent: 5476719 (1995-12-01), Sandell et al.
patent: 5488542 (1996-01-01), Ito
patent: 6262597 (2001-07-01), Chazan et al.
patent: 6437991 (2002-08-01), Rog et al.
patent: 6-283866 (1994-10-01), None

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