Wiring board and method of manufacturing wiring board

Details Wiring board and method of manufacturing wiring board Wiring board and method of manufacturing wiring board

2008-06-24

2011-10-11

Nguyen, Hoa C (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S795000, C361S809000, C361S729000, C361S735000, C174S262000, C174S255000, C174S256000

Reexamination Certificate

active

08035983

ABSTRACT:
A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler.

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