Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2010-04-09
2011-11-22
Hoang, Quoc (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE21511
Reexamination Certificate
active
08062927
ABSTRACT:
A wiring board is provided with an external connection terminal to which an electrode terminal of an electronic component is to be connected. The external connection terminal is formed so that a portion thereof is electrically connected to a pad portion exposed from an outermost insulating layer on an electronic component mounting surface of a wiring board body and so that an air gap is kept between a portion of the external connection terminal, to which the electrode terminal of the electronic component is to be connected, and the insulating layer.
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Office Action dated Jul. 26, 2011 corresponding to Japanese Patent Application No. 2008-002649 with Partial English translation.
Ol Kiyoshi
Sunohara Masahiro
Hoang Quoc
Kratz Quintos & Hanson, LLP
Shinko Electric Industries Co. Ltd.
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